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Capabilities : Advanced Technology at Standard Costs                   Technical Data       Printed Circuit Boards, rigid single-sided, double-sided   Multilayer up to 10 layers     Dimensions max. 610 x 460 mm (24” x 18”)   Basic Material FR4, FR4 halogene-free, FR2, CEM1, CEM3   Board Thickness 0.4 - 3.2mm 16 - 126 mil   Copper Foil Thickness 0.5oz - 3 oz/ft² 18 - 105 µ 0.8 mil - 4 mil                   Holes, Drilling               Smallest Hole Size 0.20 mm 8 mil           Hole Position Deviation +/- 0.05mm +/-2 mil           Min. Line Width min. 0.1mm min. 4 mil   Min. Space min. 0.1mm min. 4 mil   Outline Tolerance +/- 0.1mm             Surface Finish HAL, lead-free HAL, flash gold, immersion gold, immersion tin, OSP (Entek)           Soldermask one-/ two-sided, green   Peelable Mask one-/ two-sided, blue           Contacts Gold Finger Plating, Carbon Printing   Silk Screen white / black             Mechanical Finish Milling, Scoring/Jump-Scoring, Punching           Controlled Impedance (Ohm) 5% - 10%             Flammability 94V0             IPC Class IPC-A-600 Class II                 Key technologies :   Competitive medium to large volume production Blind & Buried Vias, Microvias (Laser Drilling) Via Plugging Lead free, RoHS and WEEE- compliant materials and finishes Controlled Impedance           Get our quotation for Printed Circuit Boards!   Enquiry

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